Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching

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dc.creatorPhommahaxay, A.
dc.creatorLissorgues, G.
dc.creatorRousseau, L.
dc.creatorBourouina, T.
dc.creatorNicole, P.
dc.date2007-11-21
dc.date.accessioned2026-07-07T08:45:35Z
dc.date.available2026-07-07T08:45:35Z
dc.descriptionAdvances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0711.3276
dc.identifierhttp://arxiv.org/abs/0711.3276
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/143006
dc.subjectOther Computer Science
dc.titleSurface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching
dc.typetext

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