Advanced Compact Thermal Modeling by using VHDL-AMS

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This paper presents an improved methodology to generate Compact Thermal Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it possible to have Boundary Conditions Independent "BCI" CTMs for multi chip components and systems while taking into account the nonlinear thermal conductivity of semiconductors and other materials.
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

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Materials Science

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http://salesiana.dossiersoluciones.com/handle/123456789/137841

Consulte el texto completo en el siguiente enlace:

https://arxiv.org/abs/0709.1830
 http://arxiv.org/abs/0709.1830
 Dans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)

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arXiv