Advanced Compact Thermal Modeling by using VHDL-AMS

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dc.creatorHabra, W.
dc.creatorTounsi, P.
dc.creatorDorkel, J. -M.
dc.date2007-09-12
dc.date.accessioned2026-07-07T08:29:05Z
dc.date.available2026-07-07T08:29:05Z
dc.descriptionThis paper presents an improved methodology to generate Compact Thermal Models "CTMs" by using (VHDL-AMS) modeling language. This methodology makes it possible to have Boundary Conditions Independent "BCI" CTMs for multi chip components and systems while taking into account the nonlinear thermal conductivity of semiconductors and other materials.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0709.1830
dc.identifierhttp://arxiv.org/abs/0709.1830
dc.identifierDans Proceedings of 12th International Workshop on Thermal investigations of ICs - THERMINIC 2006, Nice : France (2006)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/137841
dc.subjectMaterials Science
dc.titleAdvanced Compact Thermal Modeling by using VHDL-AMS
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