Package Hermeticity Testing with Thermal Transient Measurements
Abstract
Description
The rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)