Package Hermeticity Testing with Thermal Transient Measurements

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dc.creatorVass-Varnai, Andras
dc.creatorRencz, M.
dc.date2008-05-07
dc.date.accessioned2026-07-07T12:18:48Z
dc.date.available2026-07-07T12:18:48Z
dc.descriptionThe rapid incursion of new technologies such as MEMS and smart sensor device manufacturing requires new tailor-made packaging designs. In many applications these devices are exposed to humid environments. Since the penetration of moisture into the package may result in internal corrosion or shift of the operating parameters, the reliability testing of hermetically sealed packages has become a crucial question in the semiconductor industry.
dc.descriptionSubmitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
dc.identifierhttps://arxiv.org/abs/0805.0941
dc.identifierhttp://arxiv.org/abs/0805.0941
dc.identifierDans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/212534
dc.subjectOther Computer Science
dc.titlePackage Hermeticity Testing with Thermal Transient Measurements
dc.typetext

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