Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems

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Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP).
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

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Other Computer Science

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http://salesiana.dossiersoluciones.com/handle/123456789/155382

Consulte el texto completo en el siguiente enlace:

https://arxiv.org/abs/0802.3095
 http://arxiv.org/abs/0802.3095
 Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)

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arXiv