Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems
| dc.creator | Marenco, N. | |
| dc.creator | Warnat, S. | |
| dc.creator | Reinert, W. | |
| dc.date | 2008-02-21 | |
| dc.date.accessioned | 2026-07-07T09:22:28Z | |
| dc.date.available | 2026-07-07T09:22:28Z | |
| dc.description | Micromechanical devices like accelerometers or rotation sensors form an increasing segment beneath the devices supplying the consumer market. A hybrid integration approach to build smart sensor clusters for the precise detection of movements in all spatial dimensions requires a large toolbox of interconnect technologies, each with its own constraints regarding the total process integration. Specific challenges described in this paper are post-CMOS feedthroughs, front-to-front die contact arrays, vacuum-compliant lateral interconnect and fine-pitch solder balling to finally form a Chip-Scale System-in-Package (CSSiP). | |
| dc.description | Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing) | |
| dc.identifier | https://arxiv.org/abs/0802.3095 | |
| dc.identifier | http://arxiv.org/abs/0802.3095 | |
| dc.identifier | Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007) | |
| dc.identifier.uri | http://salesiana.dossiersoluciones.com/handle/123456789/155382 | |
| dc.subject | Other Computer Science | |
| dc.title | Interconnect Challenges in Highly Integrated MEMS/ASIC Subsystems | |
| dc.type | text |