High Performance Thermal Interface Technology Overview

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An overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.
Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

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General Physics

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http://salesiana.dossiersoluciones.com/handle/123456789/145482

Consulte el texto completo en el siguiente enlace:

https://arxiv.org/abs/0801.1046
 http://arxiv.org/abs/0801.1046
 Dans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)

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arXiv