High Performance Thermal Interface Technology Overview

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dc.creatorLinderman, R.
dc.creatorBrunschwiler, T.
dc.creatorSmith, B.
dc.creatorMichel, B.
dc.date2008-01-07
dc.date.accessioned2026-07-07T08:53:02Z
dc.date.available2026-07-07T08:53:02Z
dc.descriptionAn overview on recent developments in thermal interfaces is given with a focus on a novel thermal interface technology that allows the formation of 2-3 times thinner bondlines with strongly improved thermal properties at lower assembly pressures. This is achieved using nested hierarchical surface channels to control the particle stacking with highly particle-filled materials. Reliability testing with thermal cycling has also demonstrated a decrease in thermal resistance after extended times with longer overall lifetime compared to a flat interface.
dc.descriptionSubmitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)
dc.identifierhttps://arxiv.org/abs/0801.1046
dc.identifierhttp://arxiv.org/abs/0801.1046
dc.identifierDans 13th International Worshop on THERMal INvestigations of ICs and Systems - THERMINIC 2007, Budapest : Hongrie (2007)
dc.identifier.urihttp://salesiana.dossiersoluciones.com/handle/123456789/145482
dc.subjectGeneral Physics
dc.titleHigh Performance Thermal Interface Technology Overview
dc.typetext

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